EPFL spin-off building high-speed copper-based chip-to-chip interconnects (Chord signalling).
| Date | Round | Amount |
|---|---|---|
| Mar 2026 | Series A Switzerland's Kandou reportedly raised around $225M in a Series A backed by SoftBank, Synopsys and Cadence to scale its AI chip interconnects. | $225M |
| Dec 2021 | Series D Plus Swiss semiconductor startup Kandou raised USD 75M in Series D from investors including Bessemer Venture Partners and DC Investment Partners to ramp production of its Matterhorn retimer. | $75M |
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