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LENZO

Hardware · Tokyo, JP

Sviluppa l'architettura di calcolo CGLA ad alta efficienza energetica per blockchain e inferenza AI, verso il primo silicio proprietario.

Funding history

DateRoundAmount
Mar 2026Seed
LENZO closed a 500 million yen seed with Incubate Fund, Sony Innovation Fund and Mitsubishi UFJ Capital to produce the first CGLA chip.
$3.2M

Investors

Incubate FundMitsubishi UFJ CapitalSony Innovation Fund

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